
Electronic Packaging Materials and Their Properties - Pecht, Michael (University of Maryland, College Park, USA) a Agarwal, Rakish (DE Corp, Kokomo, Indiana, USA) a McCluskey, F. Patrick (University of Maryland, College Park, USA) a Dishongh, Terrance J. (Consultant, Hillsboro, Oregon, USA) a Javadpour, Sirus (Shira